EMC, SAFETY, TELECOM & NEBS
Testing and Consulting
| Home | Company | Testing Service | Testimonials | News | Contact EMT |
© 2009 Electro Magnetic Test, Inc., All rights reserved
Quick Quote
Describe your project to EMT
ELECTRO MAGNETIC TEST, INC.
Reliability Prediction Services
Mean Time Between Failure (MTBF) Calculations
The reliability prediction details the failure rates for each part and sub-
The reliability prediction can be performed either using Telcordia SR-
Failure Mode and Effects Analysis (FMEA)
FMEA is a method identifying potential failure modes and asses the risk associated
with those failure modes happening. Each failure mode is then ranked in terms of
importance and corrective actions are taken to address the most serious concerns.
Failure effects can be considered at both the sub-
Fault Tree Analysis (FTA)
Fault tree analysis is a reliability/safety design analysis technique using the concept of logic gates to determine the overall reliability of the system. The FTA first considers "Top Events" or system failure effects, and then determines the logic of events that lead to the undesirable outcome. The fault tree reveals the causes of an undesired event so improvements can be made to increase system reliability.
Highly Accelerated Life Testing (HALT )
HALT testing is an effective tool leveraging the extremes of cold temperature, hot temperature, thermal transients, and random vibration to expose defects within a product during the design phase prior to production. By eliminating these types of failure mechanisms found during the HALT process, the product reliability is greatly improved in a short period of time.
Highly Accelerated Stress Screening (HASS)
HASS is a screening process based off the HALT limits utilizing rapid thermal transitions and random vibration to expose process related variations in the manufacturing process. Once the HASS is established it is used to monitor the ongoing quality of a product as it continues through the manufacturing cycle.
Thermal Testing
Heat sensitive or excessive temperatures are often the main cause of failure in most types of equipment. Temperature testing is therefore used to determine the thermal limits during operation of a product based on the current cooling design of a particular product.
EMT provides thermal testing at all levels including printed circuit assemblies, (PCA’s), line cards, heat sink performance in both natural and forced convection environments, fan performance, ASIC components, and other critical active or passive devices throughout a system.
Electrostatic-
ESD susceptibility is a serious issue in solid state electronics and therefore one of the many areas that EMT tests to ensure proper product ruggedness against this issue. ESD is defined as a sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. Since disruptions in the product due to an ESD event may damage a product or provide a reduced reliability of the product’s capabilities, EMT applies these discharges to different parts of the product according to the standards to simulate and ESD event. ESD voltages are usually from 2kV to 15kV and can go as high as 25kV depending on the level that is regulated by international standards or a level that is necessary or desired for a particular product. EMT will test to these levels and assist you in developing a reasonable solution to any deficiencies in a product design or production weaknesses.